On-the-fly bare die bonding based on laser induced forward transfer (LIFT)

authored by

Ludger Overmeyer, Simon Nicolas Gottwald, Matthias Springer, Jan Friedrich Düsing

Abstract

Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the die transfer process is often the limiting time constraint due to the inertia of the mechanical actuators. In addition, the mechanical die ejection physically limits the minimum possible die dimensions. To overcome these limitations we developed a laser-induced on-the-fly bare die bonding technology. Experimental results verify, this technology significantly accelerates the die ejection process and enables up to 108,000 UPH. Further, this technology opens up possibilities for efficient and novel concepts for automatable production, e.g. for flexible ultra-thin wafers.

Organisation(s)

Institute of Transport and Automation Technology
PhoenixD: Photonics, Optics, and Engineering - Innovation Across Disciplines

External Organisation(s)

Laser Zentrum Hannover e.V. (LZH)

Type

Article

Journal

CIRP annals

Volume

71

Pages

41-44

No. of pages

4

ISSN

0007-8506

Publication date

2022

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Mechanical Engineering, Industrial and Manufacturing Engineering

Electronic version(s)

https://doi.org/10.1016/j.cirp.2022.03.042 (Access: Closed)