Research infrastructure in the PhoenixD Cluster of Excellence

NSM Challenger 650 printing and coating machine:

• Processing and substrate size: 150x200 mm
• Substrate thickness up to 5 cm
• Rigid substrate fixation with Metapor vacuum chuck
• Linear drive for substrate 6 m long, < 10 µm repeat accuracy
• Camera-based substrate alignment
• TSE roller slot die coating unit
• Two combination printing units: flexographic printing, gravure printing (direct/indirect), lamination
• Finely adjustable printing unit infeeds < 1 µm
• GEW mercury vapour lamp for UV curing

Please contact

Andreas Evertz, andreas.evertz@ita.uni-hannover.de

The large-scale research device Einstein-Elevator is a further development of a classical drop tower with which experiments are carried out under conditions of microgravity and a high repetition rate. The very high accuracy of the microgravity (< 10^-6 g), in addition to the higher payload of 1,000 kg, is positively influenced by the low vacuum volume to be pumped off the gondola. With a repetition rate of up to 300 experiments per day, research campaigns are carried out within a very short time.

Specifications

• Test duration: 4 s
• Total height: 40 m
• Repetition rate: 300 tests per day
• Pay load: 1 t
• Size of experiments: Ø 1.7 m x 2 m
• Residual acceleration: < 10^-6 g

Please contact

Dr.-Ing. Christoph Lotz, einstein-elevator@hitec.uni-hannover.de

The “glass 3D printing system” is a large-scale research system that enables the additive manufacturing of glass objects using laser-based fiber deposition welding processes. The laser system is also capable of joining semi-finished glass products and using laser radiation to refine the surface, for example by smoothing. The use of a heating plate also allows a wide range of glass types to be used.

Specifications

• 3 linear axes with additional rotary and tilting unit
• Absolute positioning accuracy: 50 µm
• Traversing speed: 100 mm/s
• Fiber transport speed up to 4000 mm/min
• Min. fiber diameter 0.2 mm
• Galvanometer scanner
• Heating plate max. temperature 600°C

Please contact

Khodor Sleiman, K.Sleiman@lzh.de

Specifications

• Micro assembly system for handling, characterisation and assembly of the smallest optical and photonic components from 250 µm edge length
• Wafer handling up to 6’ or 4’
• Positioning accuracy of up to 50 nm or 1 µm
• Fully automated process sequence possible
• Active and passive alignment of components and their assembly
• Assembly and connection technology using bonding processes
• Microdispensing processes
• Optical power measurement on the free beam and fibre-coupled
• Optical beam characterisation
• Spectral characterisation
• White light confocal microscopy for geometric characterisation in the assembly process

Please contact

Dr.-Ing. Gerd-Albert Hoffmann, G.Hoffmann@lzh.de

Specifications

• Preparation/polishing of substrate edges with an edge length of 4 mm
• Maximum removal 100 µm
• Based on argon ion sputtering process

Please contact

Dr. Moritz Hinkelmann, m.hinkelmann@lzh.de

Specifications

• Ion beam sputtering system for the production of complex optical thin-film systems
• Processing of substrate sizes of up to 6"
• Deposition of  and SiO₂, TiO₂ und Ta₂O₅
• High-resolution broadband monitoring system with a resolution of up to 0.1 nm in a wavelength range from 420 nm to 1680 nm
• Automatic sputter target changer
• 16 cm Veeco plasma source

Please contact

Dr.-Ing. Gerd-Albert Hoffmann, G.Hoffmann@lzh.de

Specifications

• Direct-Die-Attach system
• Die bonder for direct assembly of flexible substrates with bare dies
• Fixation with dispensed conductive adhesives
• Camera-based position detection of the dies
• Research system for assembly using LIFT (Laser Induced Forwards Transfer), thus process times of up to 100,00 chips/h possible
• Contactless assembly of bare dies directly from the wafer
• Contactless bonding of chips using LIFT
• Additionally equipped with a Coherent Laser AVIA355-23 (laser power: 23 W, pulse duration: 40 ns, wavelength 355 nm; pulse energy 250 µJ)

Please contact

Andreas Evertz, andreas.evertz@ita.uni-hannover.de

Specifications

Laser system

• Wavelength: 1030 nm or 515 nm
• Repetition rate: Single-shot - 1 MHz
• Max average power: 10W
• Stage travel range: 100 mm x 160 mm x 160 mm
• Infinite Field of View - Stichless fabrication

Multi-Photon Polymerization

• Printing of polymer structures with a feature size of ~200nm
• Possible materials: SZ2080, SU-8, Ormocers, Glassomer, hybrid organic-inorganic photopolymers, elastomers,...

Selective laser etching

• Enables substractive structuring of glass (fused silica, sapphire,...)
• Smallest feature size ~1 µm

Other Microfabrication

• Refractive index modification of transparent materials
• Micro-ablation
• Surface structuring
• Micro-welding

Please contact

Dr. Axel Günther, axel.guenther@hot.uni-hannover.de
Dr. Lei Zheng, lei.zheng@hot.uni-hannover.de

Createc MiniMBE System Type RS2-M-8-FS

Specifications

• Molecular beam epitaxy system for the production of epitaxially grown lithium niobate
• Loadlock for substrate sizes up to 1"
• 3-axis substrate manipulator
• Quartz monitor for layer thickness determination
• RHEED analysis for determining crystallinity
• Suitable for reactive coating with oxygen
• Load lock chamber, Cold-Lip Effusion Cell, Plasma Cracker Source, TUBO High Temperature Effusion-Cell, DFC Evaporator

Please contact

Dr. Andreas Wiencke, a.wienke@lzh.de

Specifications

• Active vibration isolation
• Light source is based on 4 LEDs at 630nm, 530nm, 460 nm and 575 nm
• Different measurement modi:
  • Focus variation
  • Confocal mode (Axial resolution ~1nm)
  • White light interferometry
  • Thin film measurement (50nm – 1.5µm)
• AFM-head can be installed instead of on objective
  • Scan range: 110 µm x 110 µm x 20 µm (XYZ)
  • Resolution:
    static mode ~350 pm
    Dynamic mode ~90 pm

Please contact

Dr. Axel Günther, axel.guenther@hot.uni-hannover.de

Specifications

• Machine manufacturer: KERN Microtechnik GmbH
• Control: Heidenhain TNC 640
• Year of manufacture: 2022
• Tool holder: HSK-32E
• Tool changer: 102-position
• Spindle: MFW1224 high-frequency spindle
• Max. Spindle power: 14 (S1); 16.6 (S6, 40%) kW
• Max. Spindle speed: 42,000 min-1
• Max. Torque: 6 Nm (S1), 7.5 Nm (S6, 40%)
• Working area: 350 x 220 x 250 mm
• Rotation axis: 360° endless/ 200 min-1
• Swivelling axis: 220°
• Max. Travelling speed: 60 m/min
• Acceleration: 20 m/s2
• Extensions: Swivelling/rotary table with zero-point clamping system

Please contact

Talash Malek, Malek@ifw.uni-hannover.de

X-ray photoelectron spectroscope (XPS) for the non-destructive determination of the chemical composition, primarily of solids or their surfaces.

Specifications

• PHI Versaprobe III Scanning ESCA
• Heated and cooled sample chamber
• UPS option
• LEIPS option
• Scanning Auger Option
• Gas Cluster Ion Source

Please contact

Dr. Andreas Schaate, andreas.schaate@acb.uni-hannover.de

Utilisation policy XPS

Specifications

• Traverse paths of 100 x 100 mm
• Gold ball bonding for wire thicknesses from 12 to 50 µm with standard capillaries from 16 mm to 19 mm
• Path-wedge bonding with 1″ tools for aluminium and gold wires from 12 to 75 µm thickness
• Placement accuracy of ± 5 µm
• Digital ultrasonic generator (67 kHz, max. 45 W) for any bonding frequency
• Bumping, safety bump, stitch-on-ball

Please contact

Andreas Evertz, andreas.evertz@ita.uni-hannover.de

EVG620NT Top Side Nano Imprint Lithography System
Highly precise reproduction of 2D and 2.5D structures

Specifications

• Includes 3 UV-lightsources (365nm, 405nm and 436 nm)
• Integrated mask alignment system with an accuracy of ~100nm
• Handling of wafers up to 6"
• Contact mode / Soft contact mode and Proximity mode available
• Enables vacuum imprinting
• Allows lithographic and imprint processes

Please contact

Dr. Axel Günther, axel.guenther@hot.uni-hannover.de

Multi-channel laser combiner as a source with 6 different wavelengths: A white light source and a camera for better alignment are available on the coupling side. The corresponding beams are collimated and superimposed as required. Long working distance objectives with 10x, 20x, 50x and 100x magnification are used for coupling into the sample. Identical objectives are used on the output side to collimate the transmitted light. The beam is then split to the desired detectors, e.g. camera, photodiode, spectrometer, etc., using appropriate beam splitters.

Specifications

• Multi-channel Lasercombiner for 405 nm, 450 nm, 520 nm, 561 nm, 633nm and 785nm
• 50 mW- 100 mW output power
• Multiple objectives for magnification from 5x to 100x
• Smallest spot size 1.7 µm

Please contact

Dr. Axel Günther, axel.guenther@hot.uni-hannover.de

Specifications

•  3D printing of photopolymers with Photonic Professional GT2 (Nanoscribe)
• 63x NA 1.4 or 25x NA0.8 immersion objective for focussing the laser beam (@780 nm) into the photopolymer
• Max. Object size: 100 x 100 x 8 mm³
• Min. surface roughness: < 20 nm
• Max. Scanning speed: 100 - 625 mm/s
• Resolution up to 150 nm
• Typical substrates quartz glass, borosilicate glass or silicon; customised substrates possible
• Multi-material printing possible through heteromer extension

Please contact

Dr Moritz Hinkelmann, M.Hinkelmann@lzh.de

• Combination of process technology and metrology in an atmospheric environment or vacuum in one system
• Movers move through the system without friction
• Precise control with 6 degrees of freedom
• Placement of the sample with an accuracy of up to 1 µm

Process technology:

• Pick & Place
• Microdispenser
• UV imagesetter
• Nanoimprint
• Laser structuring
• Sputter technology (vacuum)

Metrology:

• Light microscope with 1000x magnification
• Ellipsometer

Contact:

• Prof. Dr. Wolfgang Kowalsky, Wolfgang.Kowalsky@ihf.tu-bs.de
• Dr. Axel Günther, axel.guenther@hot.uni-hannover.de